鈾?/div>
High temperature soldering in accordance with
CECC 802 / Reflow guaranteed
0.320 (8.13)
0.360 (9.14)
1
K
2
0.575 (14.60)
0.625 (15.88)
SEATING
PLATE
-T-
0.090 (2.29)
0.110 (2.79)
0.018 (0.46)
0.025 (0.64)
0.027 (0.686)
0.037 (0.940)
0.080 (2.03)
0.110 (2.79)
0.095 (2.41)
0.100 (2.54)
MECHANICAL DATA
Case:
JEDEC TO-263AB molded plastic body
Terminals:
Plated lead solderable per MIL-STD-750,
Method 2026
Polarity:
As marked
Mounting Position:
Any
Weight:
0.08 ounce, 2.24 grams
PIN 1
K - HEATSINK
PIN 2
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
.
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
GIB2401
GIB2402
GIB2403
GIB2404
UNITS
Maximum recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at T
C
=125擄C
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) at T
C
=125擄C
Maximum instantaneous forward voltage per leg at:
I
F
=4A, T
J
=25擄C
I
F
=8A, T
J
=25擄C
I
F
=4A, T
J
=100擄C
I
F
=8A, T
J
=100擄C
Maximum DC reverse current
at rated DC blocking voltage
Typical junction capacitance per leg
Typical thermal resistance
(NOTE 3)
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
100
70
100
16.0
150
105
150
200
140
200
Volts
Volts
Volts
Amps
I
FSM
125.0
Amps
V
F
0.975
0.900
0.800
0.895
50.0
150.0
35.0
85.0
2.2
-65 to +150
5.0
500.0
Volts
T
C
=25擄C
T
C
=100擄C
I
R
t
rr
C
J
R
螛JC
T
J
, T
STG
碌A(chǔ)
ns
pF
擄C/W
擄C
Maximum reverse recovery time per leg
(NOTE1)
(NOTE 2)
Operating junction and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to case per leg mounted on heatsink
4/98
1
2
