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High temperature soldering guaranteed:
350擄C/10 seconds 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
P
A
T
E
N
T
0.300 (7.6)
0.230 (5.8)
0.140 (3.6)
0.104 (2.6)
DIA.
1.0
(25.4)
MIN.
Dimensions in inches and (millimeters)
MECHANICAL DATA
Case:
JEDEC DO-204AC molded plastic over glass body
Terminals:
Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.015 ounce, 0.4 gram
*
Glass-plastic encapsulation technique is covered by
Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306
廬
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
GI
810
GI
811
GI
812
GI
814
GI
816
GI
817
GI
818
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
A
=75擄C
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) at T
A
=75擄C
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at rated DC blocking voltage
Maximum reverse recovery time
(NOTE 1)
Typical junction capacitance
(NOTE 2)
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
100
70
100
200
140
200
400
280
400
1.0
600
420
600
800
560
800
1000
700
1000
Volts
Volts
Volts
Amp
I
FSM
V
F
I
R
t
rr
C
J
R
螛JA
T
J
, T
STG
30.0
1.2
10.0
100.0
750.0
25.0
45.0
-65 to +175
Amps
Volts
碌A
ns
pF
擄C/W
擄C
T
A
=25擄C
T
A
=100擄C
Typical thermal resistance
(NOTE 3)
Operating junction and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=1.0A, V
R
=30V, di/dt=50A/碌s
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, P.C.B. mounted
4/98
1
2
