鈾?/div>
High temperature soldering guaranteed:
250擄C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
1.0 (25.4)
MIN.
0.360 (9.1)
0.340 (8.6)
0.360 (9.1)
0.340 (8.6)
MECHANICAL DATA
0.052 (1.32)
0.048 (1.22)
DIA.
1.0 (25.4)
MIN.
Case:
Void-free molded plastic body
Terminals:
Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.07 ounce, 2.1 grams
Dimensions are in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
GI750
GI751
GI752
GI754
GI756
GI758
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum non-repetitive peak reverse voltage
Maximum average forward rectified current at
T
A
=60擄C, P.C.B. mounting
(FIG. 1)
T
L
=60擄C, 0.125" (3.18mm) lead length
(FIG. 2)
Peak forward surge current
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
Maximum instantaneous forward voltage at 6.0A
100A
Maximum DC reverse current
at rated DC blocking voltage
Typical junction capacitance
(NOTE 1)
Typical reverse recovery time
Typical thermal resistance
(NOTE 2)
V
RRM
V
RMS
V
DC
V
RSM
I
(AV)
50
35
50
60
100
70
100
120
200
140
200
240
400
280
400
480
6.0
22.0
400.0
0.90
1.25
5.0
1.0
150.0
2.5
20.0
4.0
600
420
600
720
800
560
800
1200
Volts
Volts
Volts
Volts
Amps
I
FSM
Amps
0.95
1.30
V
F
I
R
C
J
t
rr
R
螛JA
R
螛JL
T
J
, T
STG
Volts
碌A
mA
pF
碌s
擄C/W
擄C
T
A
=25擄C
T
A
=100擄C
(NOTE 3)
Operating junction and storage temperature range
-50 to +150
NOTES:
(1) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(2) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, Irr=0.25A
(3) Thermal resistance from junction to ambient and from junction to lead at 0.375鈥?(9.5mm) lead length,
P.C.B. mounted with 1.1 x 1.1鈥?(30 x 30mm) copper pads
10/12/98
1
2
