鈾?/div>
High temperature soldering guaranteed:
250擄C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
1.0 (25.4)
MIN.
0.210 (5.3)
0.190 (4.8)
DIA.
0.375 (9.5)
0.285 (7.2)
0.052 (1.32)
0.048 (1.22)
DIA.
1.0 (25.4)
MIN.
MECHANICAL DATA
Case:
JEDEC DO-201AD molded plastic body
Terminals:
Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.04 ounce, 1.1 grams
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
GI
500
GI
501
GI
502
GI
504
GI
506
GI
508
GI
510
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
A
= 95擄C
Peak forward surge current
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
Maximum instantaneous forward voltage T
J
= 25擄C
at 9.4A
T
J
=175擄C
Maximum DC reverse current
at rated DC blocking voltage
Typical junction capacitance
(NOTE 1)
Typical reverse recovery time
(NOTE 2)
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
100
70
100
200
140
200
400
280
400
3.0
600
420
600
800
560
800
1000
700
1000
Volts
Volts
Volts
Amps
I
FSM
100.0
1.1
1.0
5.0
50.0
28.0
2.0
20.0
5.0
-50 to +150
-50 to +175
Amps
V
F
I
R
C
J
t
rr
R
螛JA
R
螛JL
T
J
T
STG
Volts
碌A(chǔ)
pF
碌s
擄C/W
擄C
擄C
T
A
=25擄C
T
A
=100擄C
Typical thermal resistance
(NOTE 3)
Operating junction temperature range
Storage temperature range
NOTES
:
(1) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(2) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(3) Thermal resistance from junction to ambient and from junction to lead at 0.375鈥?(9.5mm) lead length, P.C.B. mounted
with 0.8 x 0.8鈥?(20 x 20mm) copper heatsinks
4/98
1
2
