鈾?/div>
High temperature soldering guaranteed:
350擄C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
N
T
E
P
A
T
E
0.034 (0.86)
0.028 (0.71)
DIA.
1.0 (25.4)
MIN.
D
0.240 (6.1)
MAX.
0.150 (3.8)
0.100 (2.5)
DIA.
1.0 (25.4)
MIN.
MECHANICAL DATA
Case:
JEDEC DO-204AP solid glass body
Terminals:
Plated axial leads, solderable per MIL-STD 750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.02 ounce, 0.56 gram
Dimensions in inches and (millimeters)
*
Brazed lead assembly is covered by Patent No. 3,930,306
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
GI1101
GI1102
GI1103
GI1104
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375" (9.5mm) lead length
(SEE FIG.1)
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) at rated T
L
Maximum instantaneous forward voltage at 2.0A
Maximum DC reverse current
at rated DC blocking voltage
Maximum reverse recovery time
(NOTE 1)
Typical junction capacitance
(NOTE 2)
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
100
70
100
2.5
150
105
150
200
140
200
2.0
Volts
Volts
Volts
Amps
I
FSM
0.975
2.0
50.0
25.0
50.0
1.25
(NOTE 5)
Amps
V
F
Volts
碌A(chǔ)
ns
pF
擄C/W
T
A
=25擄C
T
A
=100擄C
I
R
t
rr
C
J
R
螛JA
R
螛JL
T
J
, T
STG
10.0
200.0
50.0
45.0
65.0
20.0
Typical thermal resistance
(NOTE 1)
(NOTE 4)
Operating junction and storage temperature range
-65 to +175
-65 to +150
擄C
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length and mounted on P.C.B. with 0.5 x 0.5鈥?(12 x 12mm) copper pads
(4) Thermal resistance from junction to lead at 0.375" (9.5mm) lead length with both leads attached to heat sinks
(5) Tested at I
F
=1.0A
4/98
1
2
