鈾?/div>
High temperature soldering guaranteed:
350擄C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
P
A
T
E
N
T
E
0.034 (0.86)
0.028 (0.71)
DIA.
1.0 (25.4)
MIN.
0.240 (6.1)
MAX.
0.150 (3.8)
0.100 (2.5)
DIA.
1.0 (25.4)
MIN.
MECHANICAL DATA
Case:
JEDEC DO-204AP solid glass body
Terminals:
Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.02 ounce, 0.56 gram
Dimensions in inches and (millimeters)
*
Brazed lead assembly is covered by Patent No. 3,930,30
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
GI1001
GI1002
GI1003
GI1004
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
L
=75擄C
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) at T
L=
75擄C
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at rated DC blocking voltage
Maximum reverse recovery time
Typical junction capacitance
Typical thermal resistance
T
A
=25擄C
T
A
=100擄C
(NOTE 1)
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
100
70
100
1.0
150
105
150
200
140
200
Volts
Volts
Volts
Amp
I
FSM
V
F
I
R
t
rr
C
J
R
螛JA
R
螛JL
T
J
, T
STG
30.0
0.975
2.0
50.0
25.0
45.0
65.0
20.0
-65 to +175
Amps
Volts
碌A
ns
pF
擄C/W
擄C
(NOTE 2)
(NOTE 3)
(NOTE 4)
Operating junction and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length and mounted on P.C.B. with 0.5 x 0.5鈥?(12 x 12mm)
(4) Thermal resistance from junction to lead at 0.375" (9.5mm) lead length with both leads attached to heatsinks
4/98
1
2
