鈩?/div>
I
D
38A
D
G
S
0.190
(4.826)
D
0.170 (4.32) min.
0.245 (6.22)
0.235 (5.97)
0.410 (10.41)
0.380 (9.65)
0.197 (5.00)
0.177 (4.49)
0.165
(4.191)
G
S
0.060 (1.52)
0.045 (1.14)
0.100
(2.54)
0.035 (0.89)
0.028 (0.71)
0.204 (5.18)
0.156 (3.96)
0.118
(3.0)
0.040 (1.02)
0.025 (0.64)
0.023 (0.58)
0.018 (0.46)
0.045 (1.14)
0.035 (0.89)
0.020 (0.51)
min.
0.009 (0.23)
0.001 (0.03)
Dimensions in inches
and (millimeters)
0.243
(6.172)
0.063
(1.6)
Mounting Pad Layout
Mechanical Data
Case:
JEDEC TO-252 molded plastic body
Terminals:
Solder plated, solderable per MIL-STD-750,
Method 2026
High temperature soldering guaranteed:
250擄C/10 seconds at terminals
Weight:
0.011oz., 0.4g
Features
鈥?Advanced Trench Process Technology
鈥?High Density Cell Design for Ultra Low On-Resistance
鈥?Specially Designed for Low Voltage DC/DC Converters
鈥?Fast Switching for High Efficiency
鈥?Low Gate Charge
Maximum Ratings and Thermal Characteristics
(T
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
T
J
= 150擄C
Pulsed Drain Current
(1)
Power Dissipation
T
J
= 150擄C
T
C
= 25擄C
T
C
= 70擄C
T
A
= 25擄C
(2)
T
C
= 25擄C
T
C
= 70擄C
Symbol
V
DS
V
GS
I
D
I
DM
P
D
T
J
, T
stg
R
胃JC
R
胃JA
C
= 25擄C unless otherwise noted)
Limit
30
Unit
V
鹵
20
38
30
80
38
24
2.5
鈥?5 to 150
3.3
50
A
W
Operating Junction and Storage Temperature Range
Junction-to-Case Thermal Resistance
Junction-to-Ambient Thermal Resistance
(2)
Notes:
(1) Pulse width limited by maximum junction temperature
(2) Surface mounted on a 1in
2
2 oz.. Cu PCB (FR-4 material)
擄C
擄C/W
擄C/W
9/17/01