鈩?/div>
I
D
42A
D
廬
G
TO-252 (DPAK)
0.265 (6.73)
0.255 (6.48)
0.214 (5.44)
0.206 (5.23)
0.094 (2.39)
0.087 (2.21)
0.023 (0.58)
0.018 (0.46)
0.050 (1.27)
0.035 (0.89)
uct
rod
wP
Ne
G
S
0.190
(4.826)
D
0.170 (4.32) min.
0.245 (6.22)
0.235 (5.97)
0.410 (10.41)
0.380 (9.65)
0.197 (5.00)
0.177 (4.49)
0.165
(4.191)
G
S
0.060 (1.52)
0.045 (1.14)
0.100
(2.54)
0.035 (0.89)
0.028 (0.71)
0.204 (5.18)
0.156 (3.96)
0.118
(3.0)
0.040 (1.02)
0.025 (0.64)
0.023 (0.58)
0.018 (0.46)
0.045 (1.14)
0.035 (0.89)
0.020 (0.51)
min.
0.009 (0.23)
0.001 (0.03)
Dimensions in inches
and (millimeters)
0.243
(6.172)
0.063
(1.6)
Mounting Pad Layout
Mechanical Data
Case:
JEDEC TO-252 molded plastic body
Terminals:
Solder plated, solderable per MIL-STD-750,
Method 2026
High temperature soldering guaranteed:
250擄C/10 seconds at terminals
Weight:
0.011oz., 0.4g
Features
鈥?Advanced Trench Process Technology
鈥?High Density Cell Design for Ultra Low On-Resistance
鈥?Rugged-Avalanche Energy Rated
鈥?Fast Switching for High Efficiency
Maximum Ratings and Thermal Characteristics
(T
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
V
GS
=10V
Pulsed Drain Current
(1)
C
= 25擄C unless otherwise noted)
Symbol
V
DS
V
GS
T
C
= 25擄C
T
C
= 100擄C
I
D
I
DM
T
C
= 25擄C
P
D
E
AS
I
AR
E
AR
T
J
, T
stg
R
胃JC
R
胃JA
Limit
60
Unit
V
V
鹵
20
42
26
100
62.5
210
21
11
鈥?5 to 150
2
40
A
W
mJ
A
mJ
擄C
擄C/W
Maximum Power Dissipation
Single Pulse Avalanche Energy
(2)
Avalanche Current
(1)
Repetitive Avalanche Energy
(1)
Operating Junction and Storage Temperature Range
Junction-to-Case Thermal Resistance
Junction-to-Ambient Thermal Resistance
(3)
Notes:
(1) Repetitive rating; pulse width limited by max. junction temperature
(2) V
DD
= 30V, starting T
J
= 25擄C, L = 470碌H, R
G
= 25鈩? I
AS
= 21A
(3) Mounted on 1in
2
, 2oz. Cu pad on PCB
7/17/01
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