6.5m鈩?/div>
I
D
75A
CH
EN ET
uct
T
R N
F
rod
P
E
G
New
TO-263AB
TM
0.380 (9.65)
0.420 (10.67)
0.245 (6.22)
Min.
D
D
0.160 (4.06)
0.190 (4.83)
G
0.045 (1.14)
0.055 (1.40)
S
0.320 (8.13)
0.360 (9.14)
G
PIN
D
S
0.575 (14.60)
0.625 (15.88)
0.047 (1.19)
0.055 (1.40)
Mounting Pad Layout
TO-263AB
0.33
(8.38)
0.08
(2.032) 0.24
(6.096)
0.04
(1.016)
0.63
(17.02)
0.12
(3.05)
Seating Plate
-T-
0.095 (2.41)
0.100 (2.54)
0.027 (0.686)
0.037 (0.940)
0.090 (2.29)
0.110 (2.79)
0.018 (0.46)
0.025 (0.64)
0.080 (2.03)
0.110 (2.79)
0.42
(10.66)
Dimensions in inches and (millimeters)
Features
鈥?Advanced Trench Process Technology
鈥?High Density Cell Design for Ultra Low On-Resistance
鈥?Specially Designed for Low Voltage DC/DC Converters
鈥?Fast Switching for High Efficiency
鈥?High temperature soldering in accordance with
CECC802/Reflow guaranteed
Mechanical Data
Case:
JEDEC TO-263 molded plastic body
Terminals:
Leads solderable per MIL-STD-750,
Method 2026
Mounting Position:
Any
Weight:
1.3g
Maximum Ratings and Thermal Characteristics
(T
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
(1)
Pulsed Drain Current
Maximum Power Dissipation
T
A
= 25擄C
T
A
= 100擄C
Symbol
V
DS
V
GS
I
D
I
DM
P
D
T
J
, T
stg
T
L
R
胃JC
R
胃JA
A
= 25擄C unless otherwise noted)
Limit
30
鹵 20
75
240
62.5
25
鈥?5 to 150
275
2.0
62.5
Unit
V
A
W
擄C
擄C
擄C/W
擄C/W
8/1/00
Operating Junction and Storage Temperature Range
Lead Temperature (1/8鈥?from case for 5 sec.)
Junction-to-Case Thermal Resistance
Junction-to-Ambient Thermal Resistance (PCB Mounted)
Note:
(1) Maximum DC current limited by the package
1
2
3
4
