鈩?/div>
I
D
6.5A
D
D
廬
G
TSSOP-8
0.122 (3.10)
0.114 (2.90)
0.005 (0.127)
ct
odu
Pr
ew
N
G
1
G
2
8
5
0.177 (4.50)
0.170 (4.30)
0.028 (0.70)
0.020 (0.50)
Pin 1 = D
Pin 2 = S
1
Pin 3 = S
1
Pin 4 = G
1
Pin 5 = G
2
Pin 6 = S
2
Pin 7 = S
2
Pin 8 = D
S
2
S
1
0.260 (6.60)
0.244 (6.20)
1
4
0.260 (6.60) min.
0.028 (0.70)
0.020 (0.50)
0.204 (5.20)
0.025 (0.65)
0.012 (0.30)
0.010 (0.25)
0.047 (1.20)
0.041 (1.05)
0
擄
鈥?8
擄
0.012 (0.30)
0.010 (0.25)
0.025 (0.65)
0.006 (0.15)
0.002 (0.05)
Dimensions in inches
and (millimeters)
Mounting Pad Layout
Mechanical Data
Case:
TSSOP-8 Package
Terminals:
Leads solderable per MIL-STD-750,
Method 2026
High temperature soldering guaranteed:
250擄C/10 seconds at terminals
Mounting Position:
Any
Weight:
0.5g
Features
鈥?Advanced Trench Process Technology
鈥?High Density Cell Design for Ultra Low
On-Resistance
鈥?Specially Designed for Li-ion battery packs use
鈥?Designed for battery-switch applications
Maximum Ratings and Thermal Characteristics
(T
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
J
= 150擄C)
(1)
Pulsed Drain Current
Maximum Power Dissipation
(1)
T
A
= 25擄C
T
A
= 70擄C
Symbol
V
DS
V
GS
I
D
I
DM
P
D
T
J
, T
stg
R
胃JA
A
= 25擄C unless otherwise noted)
Limit
20
鹵 12
6.5
30
1.5
0.96
鈥?5 to 150
83
Unit
V
A
A
W
擄C
擄C/W
4/11/01
Operating Junction and Storage Temperature Range
Maximum Junction-to-Ambient
(1)
Thermal Resistance
Notes:
(1) Surface mounted on FR4 board, t
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