Min.
0.050 typ.
鈥?/div>
Enhancement mode MOSFET and Schottky Diode in a
compact package
鈥?Advanced Trench Process Technology and high Density
Cell Design for Ultra Low On-Resistance
鈥?Suitable for Low Voltage DC/DC Converters
鈥?High performance Schottky diode with low V
F
and high I
F
A
Maximum Ratings and Thermal Characteristics
(T
MOSFET
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
(T
J
= 150擄C)
(1)
Pulsed Drain Current
Continuous Source Current (MOSFET Diode Conduction)
(1)
Maximum Power Dissipation
(1)
T
A
= 25擄C
T
A
= 70擄C
T
A
= 25擄C
T
A
= 70擄C
Symbol
V
DS
V
GS
I
D
I
DM
I
S
P
D
T
J
, T
stg
R
胃JA
= 25擄C unless otherwise noted)
Limit
30
鹵 20
10
8
50
2.3
2.3
1.5
鈥?5 to 150
55
Unit
V
A
W
擄C
擄C/W
Operating Junction and Storage Temperature Range
Maximum Thermal Resistance Junction-to-Ambient
(1)
Schottky
Reverse Voltage
Maximum Power Dissipation
(1)
Average Forward Current
(1)
Pulsed Forward Current
Operating Junction and Storage Temperature Range
Maximum Thermal Resistance Junction-to-Ambient
(1)
Notes:
(1) Surface Mounted on FR4 Board, t
鈮?/div>
10 sec.
V
R
T
A
= 25擄C
T
A
= 70擄C
P
D
I
F
I
FM
T
J
, T
stg
R
胃JA
30
1.4
0.9
4.0
50
鈥?5 to 150
90
V
W
A
擄C
擄C/W
4/27/01
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