鈩?/div>
I
D
7.5A
S
S
S
G
1
2
3
4
8
7
6
5
D
D
D
D
Mounting Pad Layout
0.05 (1.27)
0.04 (1.02)
0.245 (6.22)
Min.
0.165 (4.19)
0.155 (3.94)
Dimensions in inches
and (millimeters)
0.050 (1.27)
0.020 (0.51)
0.013 (0.33)
0.069 (1.75)
0.053 (1.35)
0.009 (0.23)
0.004 (0.10)
0.019 (0.48)
x 45
擄
0.010 (0.25)
0.035 (0.889)
0.025 (0.635)
0.050 typ.
(1.27)
0.009 (0.23)
0.007 (0.18)
0
擄
鈥?8
擄
0.050(1.27)
0.016 (0.41)
Features
鈥?Advanced Trench Process Technology
鈥?High Density Cell Design for Ultra Low
On-Resistance
鈥?Specially Designed for Low Voltage DC/DC
Converters
鈥?Fast Switching for High Efficiency
鈥?High temperature soldering in accordance
with CECC802/Reflow guaranteed
Mechanical Data
Case:
SO-8 molded plastic body
Terminals:
Leads solderable per MIL-STD-750,
Method 2026
Mounting Position:
Any
Weight:
0.5g
Packaging codes/options:
5B - 2.5K per reel, 12.5K per carton
Maximum Ratings and Thermal Characteristics
(T
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
(1)
Pulsed Drain Current
Maximum Power Dissipation
(1)
T
A
= 25擄C
T
A
= 70擄C
Symbol
V
DS
V
GS
I
D
I
DM
P
D
T
J
, T
stg
R
胃JA
A
= 25擄C unless otherwise noted)
Limit
60
Unit
V
鹵
20
7.5
50
2.5
1.6
鈥?5 to 150
50
A
W
擄C
擄C/W
Operating Junction and Storage Temperature Range
Junction-to-Ambient Thermal Resistance (PCB mounted)
Note:
(1) Surface Mounted on FR4 Board, t
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