鈩?/div>
I
D
鈥?.4A
廬
Pin Configuration (Top View)
6
5
4
1
2
3
Dimensions in inches
and (millimeters)
Mounting Pad Layout
0.028 (0.7)
0.039
(1.07)
0.004 (0.10)
0.0005 (0.013)
0.039 (1.00)
0.036 (0.90)
0.094 (2.4)
10擄 Typical
0.037 (0.95)
Ref.
0.074 (1.9)
Ref.
Mechanical Data
Case:
SOT-23-6L package
Terminals:
Leads solderable per MIL-STD-750,
Method 2026
Marking Code:
43
Features
鈥?Advanced trench process technology
鈥?High density cell design for ultra low on-resistance
鈥?Popular SOT-23-6L package with copper lead-frame
for superior thermal and electrical capabilities
鈥?Compact and low profile
鈥?鈥?.5V rated
Maximum Ratings and Thermal Characteristics
(T
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
T
J
= 150擄C
Pulsed Drain Current
Maximum Power Dissipation
T
A
= 25擄C
T
A
= 70擄C
T
A
= 25擄C
T
A
= 70擄C
Symbol
V
DS
V
GS
I
D
I
DM
P
D
T
J
, T
stg
R
胃JA
A
= 25擄C unless otherwise noted)
Limit
鈥?0
Unit
V
鹵
12
鈥?4.4
鈥?3.5
鈥?20
2.0
1.3
鈥?5 to 150
62.5
A
A
W
擄C
擄C/W
Operating Junction and Storage Temperature Range
Maximum Junction-to-Ambient
(1)
Note:
(1) Surface Mounted on FR4 Board, t
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