鈩?/div>
I
D
7.8A
廬
G
5
SO-8
0.197 (5.00)
0.189 (4.80)
ct
odu
Pr
ew
N
D1
8
D1
7
D2
6
D2
5
Q1
Q2
8
1
2
3
4
G2
0.157 (3.99)
0.150 (3.81)
0.244 (6.20)
0.228 (5.79)
1
4
S1
G1 S2
Dimensions in inches
and (millimeters)
0.019 (0.48)
x 45
擄
0.010 (0.25)
0.05 (1.27)
0.04 (1.02)
0.245 (6.22)
Min.
0.165 (4.19)
0.155 (3.94)
0.050 (1.27)
0.020 (0.51)
0.013 (0.33)
0.069 (1.75)
0.053 (1.35)
0.009 (0.23)
0.004 (0.10)
0.009 (0.23)
0.007 (0.18)
0.035 (0.889)
0.025 (0.635)
0
擄
鈥?8
擄
0.050(1.27)
0.016 (0.41)
0.050 typ.
(1.27)
Mounting Pad Layout
Mechanical Data
Case:
SO-8 molded plastic body
Terminals:
Leads solderable per MIL-STD-750,
Method 2026
High temperature soldering guaranteed:
250擄C/10 seconds at terminals
Mounting Position:
Any
Weight:
0.5g
Features
鈥?Advanced Trench Process Technology
鈥?High Density Cell Design for Ultra Low
On-Resistance
鈥?Specially Designed for Low Voltage DC/DC
Converters
鈥?Fast Switching for High Efficiency
鈥?Logic Level
Maximum Ratings and Thermal Characteristics
(T
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Maximum Power Dissipation
(1)
T
A
= 25擄C
T
A
= 70擄C
Symbol
V
DS
V
GS
I
D
I
DM
P
D
T
J
, T
stg
R
胃JA
A
= 25擄C unless otherwise noted)
Limit
30
Unit
V
鹵
20
7.8
30
2.0
1.3
鈥?5 to 150
62.5
A
W
擄C
擄C/W
Operating Junction and Storage Temperature Range
Maximum Junction-to-Ambient
(1)
Thermal Resistance
Notes:
(1) Surface mounted on FR4 board, t
鈮?/div>
10 sec.
(2) Pulse test; pulse width
鈮?/div>
300碌s, duty cycle
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