0.117鈩?/div>
I
D
2.5A
TO-236AB (SOT-23)
.118 (3.0)
.110 (2.8)
.020 (0.51)
.015 (0.37)
Top View
.055 (1.40)
.047 (1.20)
1.
Gate
2.
Source
3.
Drain
CH
EN ET
T
REN
F
廬
0.031 (0.8)
3
G
0.035 (0.9)
0.079 (2.0)
Pin Configuration
1
2
max. .004 (0.1)
Dimensions in inches
and (millimeters)
0.037 (0.95)
.007 (.180)
.003 (.085)
0.037 (0.95)
.041 (1.03) .041 (1.03)
.035 (0.89) .035 (0.89)
.020 (0.51) .020 (0.51)
.015 (0.37) .015 (0.37)
.098 (2.5)
.091 (2.3)
Mechanical Data
Case:
SOT-23 Plastic Package
Weight:
approx. 0.008g
Marking Code:
04
.047 (1.20)
.035 (0.90)
Mounting Pad Layout
Features
鈥?Advanced trench process technology
鈥?High density cell design for ultra-low on-resistance
鈥?Popular SOT-23 package with copper lead-frame
for superior thermal and electrical capabilities
鈥?Compact and low profile
Maximum Ratings and Thermal Characteristics
Parameter
Drain-Source Voltage
Gate-Source-Voltage
Continuous Drain Current
Pulsed Drain Current
(1)
Maximum Power Dissipation
(2)
T
A
= 25擄C
T
A
= 70擄C
T
J
= 150擄C
T
A
= 25擄C
Symbol
V
DS
V
GS
I
D
I
DM
P
D
T
J
, T
stg
R
胃JA
(T
A
= 25擄C unless otherwise noted)
Limit
30
鹵
20
Unit
V
V
A
A
W
擄C
擄C/W
2.5
10
1.25
0.80
鈥?5 to +150
100
Operating Junction and Storage Temperature Range
Maximum Junction-to-Ambient Thermal Resistance
(2)
Notes:
(1) Pulse width limited by maximum junction temperature.
(2) Surface mounted on FR4 board, (1鈥?x 1鈥? 2oz. Cu)
5/3/01
1
2
3
4
5
