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High temperature soldering guaranteed:
260擄C/10 seconds, 0.375" (9.5mm) lead length,
5lbs. (2.3kg) tension
0.080 (2.03)
0.065 (1.65)
0.190 (4.83)
0.210 (5.33)
0.022 (0.56)
0.018 (0.46)
MECHANICAL DATA
Case:
Molded plastic body over passivated chip
Terminals:
Plated leads solderable per MIL-STD-750,
Method 2026
Mounting Position:
Any
(NOTE 2)
Mounting Torque:
5 in. - lb. max.
Weight:
0.15 ounce, 4.0 grams
Polarity shown on front side of case, positive lead by beveled corner
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
GBU
6A
GBU
6B
GBU
6D
GBU
6G
GBU
6J
GBU
6K
GBU
6M
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS Voltage
Maximum DC blocking voltage
Maximum average forward rectified
output current at T
C
=100擄C
(NOTE 1, 2)
Peak forward surge current single sine-wave
superimposed on rated load (JEDEC Method) T
J
=150擄C
Rating for fusing (t<8.3ms)
Maximum instantaneous forward voltage drop
per leg at 6.0A
Maximum DC reverse current at
rated DC blocking voltage per leg
Typical junction capacitance per leg
Typical thermal resistance per leg
(NOTE 1, 2)
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
I
2
t
V
F
I
R
C
J
R
螛JA
R
螛JC
T
J
, T
STG
50
35
50
100
70
100
200
140
200
400
280
400
6.0
175.0
127.0
1.0
5.0
500.0
600
420
600
800
560
800
1000
700
1000
Volts
Volts
Volts
Amps
Amps
A
2
sec
Volts
碌A(chǔ)
T
A
=25擄C
T
A
=125擄C
(NOTE 3)
211.0
7.4
2.2
-55 to +150
94.0
pF
擄C/W
擄C
Operating junction and storage temperature range
NOTES:
(1) Units case mounted on 2.6 x 1.4 x 0.06" thick (6.5 x 3.5 x 0.15 cm) Al. Plate heatsink
(2) Recommended mounting position is to bolt down on heatsink with silicone thermal compound for maximum heat transfer with #6 screws
(3) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
4/98
1
2
