FUJITSU SEMICONDUCTOR
DATA SHEET
SMALL OUTLINE L-LEADED PACKAGE
8 PIN PLASTIC
FPT-8P-M01
8-pin plastic SOP
Lead pitch
Package width
脳
package length
Lead shape
Sealing method
Mounting height
Weight
1.27 mm
5.3
脳
6.35 mm
Gullwing
Plastic mold
2.25 mm MAX
0.10 g
P-SOP8-5.3脳6.35-1.27
(FPT-8P-M01)
Code
(Reference)
8-pin plastic SOP
(FPT-8P-M01)
*
1
6.35
鈥?.20
.250
鈥?008
8
+0.25
+.010
Note 1)
*1
: These dimensions include resin protrusion.
Note 2)
*2
: These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
0.17
鈥?.04
.007
鈥?002
+0.03
+.001
5
INDEX
*
2
5.30鹵0.30 7.80鹵0.40
(.209鹵.012) (.307鹵.016)
Details of "A" part
2.00
鈥?.15
.079
鈥?006
1
4
+0.25
+.010
(Mounting height)
"A"
0.13(.005)
0.25(.010)
0~8藲
1.27(.050)
0.47鹵0.08
(.019鹵.003)
M
0.50鹵0.20
(.020鹵.008)
0.60鹵0.15
(.024鹵.006)
0.10
鈥?.05
+0.10
+.004
.004
鈥?002
(Stand off)
0.10(.004)
C
2002 FUJITSU LIMITED F08002S-c-6-7
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document.
0212
1
