Chip Schottky Barrier Diodes
FM5822V-A
Silicon epitaxial planer type
Formosa MS
SMA
0.185(4.8)
0.177(4.4)
0.012(0.3) Typ.
Features
Plastic package has Underwriters Laboratory
Flammability Classification 94V-O Utilizing Flame
Retardant Epoxy Molding Compound.
For surface mounted applications.
Exceeds environmental standards of MIL-S-19500 /
228
Low leakage current.
0.067(1.7)
0.060(1.5)
0.110(2.8)
0.094(2.4)
0.165(4.2)
0.150(3.8)
0.040(1.0) Typ.
0.040 (1.0) Typ.
Mechanical data
Case : Molded plastic, JEDEC DO-214AC
Terminals : Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity : Indicated by c athode band
Mounting P
osition : Any
Weight : 0.0015 ounce, 0.05 gram
Dimensions in inches and (millimeters)
MARKING CODE : SK34
MAXIMUM RATINGS
(AT T
A
=25
o
C unless otherwise noted)
PARAMETER
Repetitive peak reverse voltage
RMS voltage
Continuous reverse voltage
Forward rectified current
Forward surge current
Thermal resistance
Diode junction capacitance
Operating temperature
Storage temperature
Ambient temperature = 80
o
C
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
Junction to ambient
f=1MHz and applied 4vDC reverse voltage
CONDITIONS
Symbol
V
RRM
V
RMS
V
R
I
O
I
FSM
Rq
JA
C
J
T
J
T
STG
-50
-50
MIN.
TYP.
MAX.
40
28
40
3.0
80
55
250
+125
+150
o
UNIT
V
V
V
A
A
C / w
pF
o
o
C
C
ELECTRICAL CHARACTERISTICS
(AT T
A
=25
o
C unless otherwise noted)
PARAMETER
Forward voltage
Reverse current
IF = 1.0 AMPERE DC
V
R
= Peak reverse voltage T
A
=
25 C
o
CONDITIONS
Symbol
V
F
I
R
MIN.
TYP.
MAX.
0.40
0.5
20
UNIT
V
mA
mA
V
R
= Peak reverse voltage T
A
= 100
o
C
1
2
