Chip Schottky Barrier Diodes
FM5822-A
Silicon epitaxial planer type
Formosa MS
SMA
0.185(4.8)
0.173(4.4)
0.012(0.3) Typ.
Features
Plastic package has Underwriters Laboratory
Flammability Classification 94V-O Utilizing Flame
Retardant Epoxy Molding Compound.
For surface mounted applications.
Exceeds environmental standards of MIL-S-19500 /
228
Low leakage current.
0.067(1.7)
0.060(1.5)
0.110(2.8)
0.094(2.4)
0.165(4.2)
0.150(3.8)
0.040(1.0) Typ.
0.040 (1.0) Typ.
Dimensions in inches and (millimeters)
Mechanical data
Case : Molded plastic, JEDE DO-214AC
C
Terminals : Solder plated, s olderable per MIL-STD-750,
Method 2026
Polarity : Indicated by cathode band
Mounting P
osition : Any
Weight : 0.0015 ounce, 0.15 gr am
MAXIMUM RATINGS
(AT T
A
=25
o
C unless otherwise noted)
PARAMETER
Forward rectified current
See Fig.1
IF = 1 A , T
A
=
Forward voltage
IF = 2 A , T
A
=
IF = 1 A , T
A
=
IF = 2 A , T
A
=
Forward surge current
peak reverse voltage
RMS voltage
Continuous reverse voltage
Reverse current
Thermal resistance
Diode junction capacitance
Operating temperature
Storage temperature
V
R
= V
RRM
T
A
=
25 C
o
o
CONDITIONS
Symbol
I
O
MIN.
TYP.
MAX.
3.0
0.42
0.49
0.34
0.43
80
40
28
40
0.5
20
UNIT
A
V
V
V
V
A
V
V
V
mA
mA
o
25 C
25 C
125
o
C
125 C
o
o
o
V
F
V
F
V
F
V
F
I
FSM
V
RRM
V
RMS
V
R
I
R
Rq
JA
C
J
T
J
T
STG
-55
-55
250
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
V
R
= V
RRM
T
A
= 125 C
Junction to ambient
f=1MHz and applied 4vDC reverse voltage
80
C / w
pF
+150
+150
o
o
C
C
1
2
