Chip Schottky Barrier Diodes
FM0206
Silicon epitaxial planer type
Formosa MS
PATENT PUBLICATION NO. 37116
SMA
0.185(4.8)
0.177(4.4)
0.012(0.3) Typ.
Features
Plastic package has Underwriters Laboratory
Flammability Classification 94V-O Utilizing Flame
Retardant Epoxy M
olding Compound.
For surface mounted applications.
Exceeds environmental standards of MIL-S-19500 /
228
Low leakage current.
0.110(2.8)
0.094(2.4)
0.165(4.2)
0.150(3.8)
0.067(1.7)
0.060(1.5)
0.040(1.0) Typ.
0.040 (1.0) Typ.
Mechanical data
Case : Molded plastic, JEDEC DO-214AC
Terminals : Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity : Indicated by c athode band
Mounting P
osition : Any
Weight : 0.0015 ounce, 0.05 gram
Dimensions in inches and (millimeters)
o
MAXIMUM RATINGS
(AT T
A
=25 C unless otherwise noted)
PARAMETER
Forward rectified current
Forward surge current
See Fig.1
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
V
R
= V
RRM
T
A
=
25
o
C
I
R
Rq
JA
C
J
T
STG
-55
88
120
+150
CONDITIONS
Symbol
I
O
I
FSM
MIN.
TYP.
MAX.
0.2
15
5
20
o
UNIT
A
A
uA
uA
C / w
pF
o
Reverse current
Thermal resistance
Diode junction capacitance
Storage temperature
V
R
= V
RRM
T
A
= 125
o
C
Junction to ambient
f=1MHz and applied 4vDC reverse voltage
C
SYMBOLS
MARKING
CODE
SK14
V
RRM
*1
V
RMS
*2
V
R
*3
V
F
*4
Operating
temperature
(
o
C)
-55 to +125
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage
(V)
FM0206
6.0
(V)
4.2
(V)
6.0
(V)
0.50
1
2
