1mm Pitch FPC/FFC Connector
FH 21 Series
sFeatures
1. LIF (Low Insertion Force) Mechanism
LIF mechanism secures mounting serviceability.
2. Kink Mechanism
DIP post is treated with kinks, and prevent connector
floating in the soldering process.
3. Contact Structure on Both Sides
The contact structure on both sides does restrict
directionality of FPC and FFC conductors.
sApplications
HDD, facsimiles, printers, and crystal liquie modules, etc.
sProduct
Specifications
Rated Current: 0.5A
Rating
Operating Temperature Range:
-30 ~
+70莽
(Note 1)
Storage Temperature Range: -10
~
+50莽
(Note 2)
(Not dewed)
Applicable FPC
Item
1. Insulation Resistance
2. Withstand voltage
3. Contact Resistance
4.
Mechanical
Operation
500M酶
min.
Neither short nor breakdown should occur
40m酶
*FPC
conductor resistance included
Contact resistance: 40m酶 max.
No part should be damaged, cracked, or loosened
Electrical discontinuity, 1碌S max.
5.
Vibration
Contact resistance: 40m酶
No part should be damaged, cracked, or loosened
Electrical discontinuity, 1碌S max.
6.
Shock
Contact resistance: 40m酶 max.
No part should be damaged, cracked, or loosened
7.
Moisture Resistance
7.
in Steady State
Note 1.
Note 2.
Note 2.
Note 3.
Contact resistance: 40m酶 max.
Insulation resistance: 50M酶 max.
Acceleration: 490m/s, duration: 11ms, sine half-wave
in 3 directions for 3 cycles, respectively
Exposed to temperature 60莽 and humidity 90~95%
Frequency 10~55Hz and single amplitude 0.75mm in
3 directions for 2 hours, respectively.
t=0.3鹵0.05 Solder plating
Specification
Measured at 100V DC
150V AC for 1 minute
Measured at 100mA
10 cycles
Condition
(Not dewed)
Rated Voltage: 50V AC Operating Humidity Range: Relative humidity 90% max. Storage Humidity Range: Relative Humidity: 90% max.
for 96 hours
No part should be damaged, cracked, or loosened
Temperature rise included when energized
This storage indicates a long-term storage state for the unused product before the board mounted.
The operating temperature and humidity ranges are applied to the non-energized state after the connector has been
installed in the board.
The above standards represent this series. The individual formal agreement should be based on the "Specification".
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