餂?/div>
BGA MOSFET
General Description
Combining Fairchild鈥檚 30V PowerTrench process with
state of the art BGA packaging, the FDZ5047N
minimizes both PCB space and R
DS(ON)
. This BGA
MOSFET embodies a breakthrough in packaging
technology which enables the device to combine
excellent thermal transfer characteristics, high current
handling capability, ultra-low profile packaging, low gate
charge, and low R
DS(ON)
.
These MOSFETs feature faster switching and lower
gate charge than other MOSFETs with comparable
R
DS(ON)
specifications resulting in DC/DC power supply
designs with higher overall efficiency.
Features
鈥?/div>
22 A, 30 V.
R
DS(ON)
= 2.9 m鈩?@ V
GS
= 10 V
R
DS(ON)
= 4.5 m鈩?@ V
GS
= 4.5 V
鈥?/div>
Occupies only 27.5 mm of PCB area:
1/5 of the area of a TO-220 package
鈥?/div>
Ultra-thin package: less than 0.90 mm height when
mounted to PCB
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Outstanding thermal transfer characteristics
鈥?/div>
Ultra-low gate charge x R
DS(ON)
product
2
Applications
鈥?/div>
DC/DC converters
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Solenoid drive
D
D
D
D
D
Pin 1
D
S
S
S
S
G
D
S
S
S
S
D
S
S
S
S
D
S
S
S
S
D
D
D
D
D
D
F50 4 7
Pin 1
G
D
S
S
S
D
Bottom
Top
T
A
=25 C unless otherwise noted
o
S
Absolute Maximum Ratings
Symbol
V
DSS
V
GSS
I
D
P
D
T
J
, T
STG
Drain-Source Voltage
Gate-Source Voltage
Drain Current
鈥?Continuous
鈥?Pulsed
Parameter
Ratings
30
鹵20
(Note 1a)
Units
V
A
W
擄C
22
75
2.8
鈥?0 to +150
Total Power Dissipation @ T
A
= 25擄C
Operating and Storage Junction Temperature Range
Thermal Characteristics
R
胃JA
R
胃JB
R
胃JC
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Ball
Thermal Resistance, Junction-to-Case
(Note 1a)
(Note 1)
(Note 1)
44
2.7
0.3
擄C/W
Package Marking and Ordering Information
Device Marking
5047N
餂?004
Fairchild Semiconductor Corporation.
Device
FDZ5047N
Reel Size
13鈥欌€?/div>
Tape width
12mm
Quantity
3000 units
FDZ5047N Rev D4 (W)
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FDZ5047N相關(guān)型號(hào)PDF文件下載