鈩?/div>
@ V
GS
= -4.5 V.
High density cell design for extremely low R
DS(ON)
.
High power and current handling capability in a widely
used surface mount package.
Dual MOSFET in surface mount package.
SOT-23
SuperSOT
TM
-6
SuperSOT
TM
-8
SO-8
SOT-223
SOIC-16
D2
D1
D1
D2
5
4
3
2
1
DS A
F 7
4
89
pin
1
6
SO-8
S1
G1
S2
G2
7
8
Absolute Maximum Ratings
Symbol
V
DSS
V
GSS
I
D
P
D
Parameter
Drain-Source Voltage
Gate-Source Voltage
Drain Current - Continuous
- Pulsed
T
A
= 25
o
C unless other wise noted
FDS8947A
-30
-20
(Note 1a)
Units
V
V
A
W
- 4.0
-20
2
1.6
1
0.9
-55 to 150
78
40
Power Dissipation for Dual Operation
Power Dissipation for Single Operation
(Note 1a)
(Note 1b)
(Note 1c)
T
J
,T
STG
R
胃
JA
R
胃
JC
Operating and Storage Temperature Range
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
擄C
擄C/W
擄C/W
THERMAL CHARACTERISTICS
(Note 1a)
(Note 1)
漏 1998 Fairchild Semiconductor Corporation
FDS8947A Rev.B