鈥?/div>
FLMP SO-8 package for enhanced thermal
performance in industry-standard package size
NC
D
NC
D
NC
D
NC
D
FLMP SO-8
D
Bottom Side Drain Contact
5
6
4
3
2
1
Pin 1
SO-
G
S G
S S
S S
S
T
A
=25 C unless otherwise noted
o
7
8
Absolute Maximum Ratings
Symbol
V
DSS
V
GSS
I
D
P
D
T
J
, T
STG
Drain-Source Voltage
Gate-Source Voltage
Drain Current
鈥?Continuous
鈥?Pulsed
Parameter
Ratings
鈥?0
鹵25
(Note 1a)
Units
V
V
A
W
擄C
鈥?6
鈥?0
3.13
1.5
鈥?5 to +150
Power Dissipation for Single Operation
(Note 1a)
(Note 1b)
Operating and Storage Junction Temperature Range
Thermal Characteristics
R
胃JA
R
胃JC
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1a)
(Note 1)
40
0.5
擄C/W
Package Marking and Ordering Information
Device Marking
FDS7079ZN3
餂?004
Fairchild Semiconductor Corporation
Device
FDS7079ZN3
Reel Size
13鈥欌€?/div>
Tape width
12mm
Quantity
2500 units
FDS7079ZN3 Rev C1 (W)
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