.
鈥?/div>
175擄C maximum junction temperature rating.
D
D
G
G
D
TO-220
S
FDP Series
G
S
TO-263AB
FDB Series
S
Absolute Maximum Ratings
Symbol
V
DSS
V
GSS
I
D
P
D
T
J
, T
STG
T
L
Drain-Source Voltage
Gate-Source Voltage
Maximum Drain Current
T
A
=25
o
C unless otherwise noted
Parameter
鈥?Continuous (note 3)
鈥?Pulsed
Total Power Dissipation @ T
C
= 25擄C
Derate above 25擄C
Operating and Storage Junction Temperature Range
Maximum lead termperature for soldering purposes,
1/8鈥?from case for 5 seconds
FDP5645
FDB5645
Units
V
V
A
W
W/擄C
擄C
擄C
60
鹵20
80
300
125
0.83
-65 to +175
+275
Thermal Characteristics
R
胃J
C
R
胃JA
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient
1.2
62.5
擄C/W
擄C/W
Package Marking and Ordering Information
Device Marking
FDB5645
FDP5645
Device
FDB5645
FDP5645
Reel Size
13鈥?/div>
note 2
Tape width
24mm
Quantity
800 units
漏
2000 Fairchild Semiconductor Corporation
FDP5645/FDB5645 Rev B (W)
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