.
鈻?/div>
High power version of industry Standard SOT-23 package.
Identical pin-out to SOT-23 with 30% higher power handling
capability.
General Description
This P-Channel Logic Level MOSFET is produced using Fair-
child Semiconductor advanced Power Trench process that has
been especially tailored to minimize the on-state resistance and
yet maintain low gate charge for superior switching perfor-
mance.
These devices are well suited for low voltage and battery pow-
ered applications where low in-line power loss is needed in a
very small outline surface mount package.
Applications
鈻?/div>
Notebook computer power management
D
D
S
G
G
S
SuperSOT鈩?3
Absolute Maximum Ratings
T
A
= 25擄C unless otherwise noted
Symbol
V
DSS
V
GSS
I
D
P
D
T
J
, T
STG
R
胃
JA
R
胃
JC
Drain-Source Voltage
Gate-Source Voltage
Drain Current
鈥?Continuous
鈥?Pulsed
Power Dissipation for Single Operation
(Note 1a)
(Note 1b)
Operating and Storage Junction Temperature Range
(Note 1a)
Parameter
Ratings
鈥?0
鹵
25
鈥?.3
鈥?0
0.5
0.46
鈥?5 to +150
Units
V
V
A
W
擄
C
擄
C/W
Thermal Characteristics
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1a)
(Note 1)
250
75
Package Marking and Ordering Information
Device Marking
52AP
Device
FDN352AP
Reel Size
7鈥欌€?/div>
Tape width
8mm
Quantity
3000 units
漏2005 Fairchild Semiconductor Corporation
1
www.fairchildsemi.com
FDN352AP Rev. C
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