FDM606P
July 2002
FDM606P
P-Channel 1.8V Logic Level Power Trench
廬
MOSFET
General Description
This P-Channel MOSFET is produced using Fairchild
Semiconductor鈥檚 advanced PowerTrench process that has
been especially tailored to minimize the on-state resistance
and yet maintain low gate charge for superior switching
performance. These devices are well suited for portable
electronics applications.
Features
鈥?Fast switching
鈥?r
DS(ON)
= 0.026鈩?(Typ), V
GS
= -4.5V
鈥?r
DS(ON)
= 0.033鈩?(Typ), V
GS
= -2.5V
鈥?r
DS(ON)
= 0.052鈩?(Typ), V
GS
= -1.8V
Applications
鈥?Load switch
鈥?Battery charge
鈥?Battery disconnect circuits
D
Bottomview 3 X 2 (8 Lead)
SinglePad
ShortPin
D
G
D
D
1
2
8
7
6
5
1
D
D
D
3
4
S
S
MicroFET 3x2-8
MOSFET Maximum Ratings
T
A
=25擄C unless otherwise noted
Symbol
V
DSS
V
GS
Drain to Source Voltage
Gate to Source Voltage
Drain Current
Continuous (T
C
= 25
o
C, V
GS
= - 4.5V)
I
D
Continuous (T
C
= 100 C, V
GS
= - 2.5V)
Continuous (T
C
= 100 C, V
GS
= -1.8V)
Pulsed
P
D
T
J
, T
STG
Power dissipation
Derate above 25擄C
Operating and Storage Temperature
o
o
Parameter
Ratings
-20
鹵8
-6.8
-3.8
-3.0
Figure 4
1.92
15.4
-55 to 150
Units
V
V
A
A
A
W
mW/
o
C
o
C
Thermal Characteristics
R
胃JC
R
胃JA
Thermal Resistance Junction to Case (Note1)
Thermal Resistance Junction to Ambient (Note 2)
6.0
65
o
C/W
o
C/W
Package Marking and Ordering Information
Device Marking
.06P
Device
FDM606P
Package
MicroFET3x2
Reel Size
178 mm
Tape Width
8 mm
Quantity
3000
漏2002 Fairchild Semiconductor Corporation
FDM606P Rev. C