鈥?/div>
FLMP SC75 package: Enhanced thermal
performance in industry-standard package size
Bottom Drain Contact
S2
S1
G1
4
5
3
2
1
Bottom Drain Contact
S1
S2
G2
6
MOSFET Maximum Ratings
Symbol
V
DSS
V
GSS
I
D
P
D
T
J
, T
stg
T
A
=25
o
C unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Drain Current
鈥?Continuous
(Note 1a)
Ratings
鈥?0
鹵8
鈥?.8
鈥?2
1.5
0.9
鈥?5 to +150
Units
V
V
A
鈥?Pulsed
Power Dissipation for Single Operation
(Note 1a)
(Note 1b)
Operating and Storage Junction Temperature Range
擄C
Thermal Characteristics
R
胃JA
R
胃JC
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1a)
80
5
擄C/W
Package Marking and Ordering Information
.G
FDJ1027P
7鈥欌€?/div>
8mm
3000 units
2004 Fairchild Semiconductor Corporation
FDJ1027P Rev C1 (W)
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