鈩?/div>
@ V
GS
= -4.5 V.
SuperSOT
TM
-6 package design using copper lead frame for
superior thermal and electrical capabilities.
High density cell design for extremely low R
DS(ON)
.
Exceptional on-resistance and maximum DC current capability.
SOT-23
SuperSOT -6
TM
SuperSOT
TM
-8
SO-8
SOT-223
SOIC-16
S
D
D
1
6
4
.65
G
pin
1
2
5
D
D
SuperSOT
TM
-6
3
4
Absolute Maximum Ratings
T
A
= 25擄C unless otherwise note
Symbol Parameter
V
DSS
V
GSS
I
D
P
D
Drain-Source Voltage
Gate-Source Voltage - Continuous
Drain Current - Continuous
- Pulsed
Maximum Power Dissipation
(Note 1a)
(Note 1b)
(Note 1a)
FDC654P
-30
鹵20
-3.6
-10
1.6
0.8
-55 to 150
Units
V
V
A
W
T
J
,T
STG
R
胃JA
R
胃JC
Operating and Storage Temperature Range
擄C
THERMAL CHARACTERISTICS
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1a)
(Note 1)
78
30
擄C/W
擄C/W
漏 1998 Fairchild Semiconductor Corporation
FDC654P Rev.C