PDF預(yù)覽

• 1

DOCUMENT CONTROL NO.

.630

16.00 BSC

Square

PD - 1805

REVISION: C

DATE: 03/09/05

.551

14.00 BSC

Square

.004

.008

0.09

0.20

GAUGE PLANE

0.25 mm

.018

0.45

.030

0.75

.039

1.00 REF

.063

1.60

Max.

1

.004

0.10

Seating Plane

.007

0.17

.010

0.27

X.XX

DENOTES DIMENSIONS

X.XX

IN MILLIMETERS

.031

0.80 BSC

.002

.006

0.05

0.15

.053

.057

1.35

1.45

Notes:

1. All dimensions in millimeters

2. Ref.: JEDEC MS-026D/BEB

3. Package Outline Exclusive of Mold Flash and Metal Burr

Pericom Semiconductor Corporation

3545 N. 1st Street, San Jose, CA 95134

1-800-435-2335 鈥?www.pericom.com

DESCRIPTION: 64-Pin, Low Profile Quad Flat Package, LQFP

PACKAGE CODE: FD

FD64相關(guān)型號PDF文件下載

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  描述
  廠商
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• FD64
  英文版
  64-Pin, Low Profile Quad Flat Package, LQFP
  
  FD64
• FD64
  英文版
  64-Pin, Low Profile Quad Flat Package, LQFP
  PERICOM [P...
  FD64

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