鈼?/div>
G
!
G DS
TO-220
FCP Series
GD S
TO-220F
FCPF Series
!
S
Absolute Maximum Ratings
Symbol
I
D
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt
P
D
T
J
, T
STG
T
L
Drain Current
Drain Current
T
C
= 25擄C unless otherwise noted
Parameter
- Continuous (T
C
= 25擄C)
- Continuous (T
C
= 100擄C)
- Pulsed
(Note 1)
FCP11N60
11
7
33
FCPF11N60
11*
7*
33*
鹵
30
340
11
12.5
4.5
Units
A
A
A
V
mJ
A
mJ
V/ns
W
W/擄C
擄C
擄C
Gate-Source Voltage
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (T
C
= 25擄C)
(Note 2)
(Note 1)
(Note 1)
(Note 3)
- Derate above 25擄C
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
125
1.0
36
0.29
-55 to +150
300
* Drain current limited by maximum junction termperature
Thermal Characteristics
Symbol
R
胃JC
R
胃CS
R
胃JA
Parameter
Thermal Resistance, Junction-to-Case
Thermal Resistance, Case-to-Sink
Thermal Resistance, Junction-to-Ambient
FCP11N60
1.0
0.5
62.5
FCPF11N60
3.5
--
62.5
Units
擄C/W
擄C/W
擄C/W
漏2004 Fairchild Semiconductor Corporation
Rev. B, March 2004