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Product number (please refer to page 1)
High-density mounting-type SMD of 0.8 mm Typ. thickness.
Small packaging area and light weight.
Excellent environmental capability.
Most suitable for small communications devices.
Available for lead (Pb)-free soldering.
Lead (Pb)-free terminal product.
Actual size
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Specifications (characteristics)
Item
Nominal frequency range
Temperature
range
Maximum drive level
Frequency tolerance (standard)
Peak temperature (frequency)
Temperature coefficient (frequency)
Load capacitance
Series resistance
Motional capacitance
Shunt capacitance
Insulation resistance
Aging
Shock resistance
Storage temperature
Operating temperature
Symbol
f
T
STG
T
OPR
GL
螖f/f
胃T
a
C
L
R
1
C
1
C
0
IR
fa
S.R.
65 k惟 Max.
1.7 fF Typ.
1.3 pF Typ.
500 M惟 Min.
鹵3 x 10
-6
/ year Max.
鹵8 x10
-6
Max.
Ta = +25 藲C 鹵3 藲C, first year
100 g dummy (Seiko Epson Standard) drop from
1500 mm height on to the concrete 3 directions
10 times.
鹵20 x 10
-6
+25 藲C 鹵5 藲C
-0.04 x 10
-6
/ 藲C
2
Max.
7 pF, 12.5 pF
70 k惟 to 25 k惟
2.5 fF to 0.7 fF
1.6 pF to 0.7 pF
Please specify
32.768 kHz
-55 藲C to +125 藲C
-40 藲C to +85 藲C
0.5 碌W Max.
鹵50 x 10
-6
,鹵100 x 10
-6
Ta = +25 藲C, DL = 0.1 碌W
Please ask tighter tolerance
Specifications
32.000 kHz
Remarks
please contact us for inquiries
about the available frequency
Stored as bare product after unpacking
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External dimensions
(Unit: mm)
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Recommended soldering pattern
(Unit: mm)
Internal connection
1.8鹵0.1
1.3
#1
#2
0.8
鹵0.1
4.2
0.85
#1
#2
鈭桪o
not design any patterns on shaded area.
3.2
2.2
4.9鹵0.1
22
1
2
