ULTRA THIN MCP ASSEMBLY
WITH CENTER HOLE
F6589
FEATURES
q
Ultra Thin Type: 2.5 mm (Max.)
鈥?Detection at closed distance from samples
q
Flexible Lead Out (polymide film)
鈥?Easy system design with a flexible wiring
鈥?Low outguessing for high vacuum operation
q
Light Weight
APPLICATIONS
q
SEM
q
FIB System
q
Mask Aligner
q
Electron Beam Measuring System
TMCPF0083
SPECIFICATIONS
Parameter
Value
Unit
GENERAL
Assembly Outer Diameter
Effective Diameter
Maximum Height
MCP Channel Diameter
MCP Stage Number
Centerpipe Inner Diameter
Dead Area around Center Hole
Electrical Potential
MCP-in
Anode
28.0
11.0
2.5
12
2
1
4
-0.4 to +0.4
+2.4 (Max.)
mm
mm
mm
碌m
stage
mm
mm
kV
MAXIMUM RATINGS
MCP Supply Voltage (In-Out)
MCP Out-Anode Voltage
Anode-Substrate Voltage
Operating Vacuum Condition
Ambient Temperature
Baking Temperature
Baking Time
Vacuum Condition for Baking
鈥?Not allowed to be baked.
2.0
0.4
2.4
Less than 6.7
脳
10
-4
(5
脳
10
-6
)
-50 to +70
200
8
Less than 6.7
脳
10
-4
(5
脳
10
-6
)
kV
kV
kV
Pa (Torr)
擄C
擄C
hours
Pa (Torr)
CHARACTERISTICS
Gain at 1.8kV
Plate Resistance
Maximum Linear Output
DC Dark Current at 2kV
Dark Count at 2kV
1
脳
10
6
Min.
50 to 200
7% of strip current under uniform input into
whole MCP effective area
1
脳
10
-10
3
鈥?/div>
M鈩?MCP
碌A(chǔ)
A
cps
Subject to local technical requirements and regulations, availability of products included in this promotional material may vary. Please consult with our sales office.
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.
Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. 漏 1997 Hamamatsu Photonics K. K.
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