DIODE
Type
:
EC10DS1
OUTLINE DRAWING
FEATURES
* Miniature Size,Surface Mount Device
* High Surge Capability
* Low Forward Voltage Drop
* Low Reverse Leakage Current
* Packaged in 12mm Tape and Reel
* Not Rolling During Assembly
Maximum Ratings
Rating
Repetitive Peak Reverse Voltage
Non-repetitive Peak Reverse Voltage
Average Rectified Output Current
RMS Forward Current
Surge Forward Current
Operating JunctionTemperature Range
Storage Temperature Range
Approx Net Weight:0.06g
Symbol
V
RRM
V
RSM
I
O
I
F(RMS)
I
FSM
T
jw
T
stg
25
0.74
1.0
EC10DS1
100
250
Ta=25
擄C
*1
Ta=25
擄C
*2
50Hz Half Sine
Wave Resistive Load
Unit
V
V
A
A
A
擄C
擄C
1.57
50Hz Half Sine Wave,1cycle
Non-repetitive
-40 to +150
-40 to +150
Electrical
鈥?/div>
Thermal Characteristics
Characteristics
Peak Reverse Current
Peak Forward Voltage
Thermal Resistance
Symbol
I
RM
V
FM
Conditions
Tj= 25擄C, V
RM
= V
RRM
Tj= 25擄C, I
FM
= 1.0A
Min.
-
-
-
-
Typ.
-
-
-
-
Max.
10
1.1
157
108
Unit
碌A(chǔ)
V
擄C
/W
*1
*2
*1 Glass Epoxy Substrate Mounted (Soldering Lands=2x2mm,Both Sides)
*2 Alumina Substrate Mounted (Soldering Lands=2x2mm,Both Sides)
Rth
(j-a)
Junction to Ambient
1
2
