Plastic Packages for Integrated Circuits
Dual-In-Line Plastic Packages (PDIP)
N
E1
INDEX
AREA
1 2 3
N/2
E28.6A-S
28 LEAD DUAL-IN-LINE PLASTIC PACKAGE
INCHES
SYMBOL
A
D
MILLIMETERS
MIN
4.5
0.50
0.40
1.05
0.20
37.7
12.9
MAX
5.0
-
0.60
1.35
0.35
38.2
13.3
2.54 BSC
15.24 BSC
3.0
28
0
o
-
15
o
NOTES
2
2
-
-
-
3
3
-
4
2
5
-
Rev. 1 4/95
MIN
0.178
0.020
0.016
0.042
0.008
1.485
0.508
MAX
0.196
-
0.023
0.053
0.13
1.503
0.523
A1
B
A
L
A1
C
L
BASE
PLANE
SEATING
PLANE
B1
C
D
E1
e
e
A
e
A
B1
B
e
偽
C
0.100 BSC
0.600 BSC
0.119
28
0
o
15
o
-
NOTES:
1. Controlling Dimensions: MILLIMETER. In case of conflict be-
tween English and Metric dimensions, the metric dimensions
control.
2. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
3. D and E1 dimensions do not include mold flash or protrusions.
4. e
A
is measured with the leads constrained to be perpendicular
to base plane.
5. N is the maximum number of terminal positions.
L
N
偽
13
1
