PRELIMINARY
DS3800
Advanced NV SRAM Battery Cap
www.dalsemi.com
FEATURES
Houses 400 mAh primary lithium battery
Snaps directly onto a surface鈥搈ounted 40mm
ball鈥揼rid array (BGA) Nonvolatile SRAM
module
Attaches after host BGA module has been
surface鈥搈ounted to protect lithium battery
from the high temperatures of reflow
soldering
Maintains mechanical and electrical
connection with BGA module even during
severe shock and vibration stresses
Four attachment flanges latch onto host BGA
module to provide strong, semi鈥損ermanent
attachment. Flanges can be broken off for cap
removal
Industrial temperature range of 鈥?0擄C to
+85擄C
PIN ASSIGNMENT
b脛茫茫脛鉚
q脩氓脿脟茅莽脡卯脟矛茅毛
bqQVNN
`脛矛矛脩毛貌>a脛貓
WWvv`
vvvvvv
ABSOLUTE MAXIMUM RATINGS
Operating Temperature
Non-Operating Temperature
-40擄C to 85擄C
-40擄C to 85擄C
attery Cap
BATTERY CHARACTERISTICS
Nominal Voltage
Nominal Capacity
Chemistry
Data Retention Life
3 volts
400 mAh
Li(CF)x
8 Years (25擄C)
DESCRIPTION
The DS3800 Battery Cap is a snap鈥搊n lithium power source for Dallas Semiconductors 40mm ball鈥揼rid
array (BGA) Nonvolatile SRAM modules. After a host BGA module has been soldered in place and
cleaned, the DS3800 Battery Cap is snapped onto the module to serve as the secondary power supply.
The Battery Cap is keyed to prevent incorrect attachment and is designed to maintain mechanical and
electrical contact with its host module even during severe shock and vibration. Electrically, the DS3800
battery is connected to the host BGA module with gold鈥損lated round pins in the Battery Cap inserted into
gold鈥損lated receptacles on the BGA. Mechanically, four flanges on the DS3800 tightly grip the BGA
module board to prevent Cap removal, while corner features in the Cap prevent lateral movement of the
Cap while it is attached to its host BGA module.
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