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DS3170LN Datasheet

  • DS3170LN

  • DS3/E3 Single-Chip Transceiver

  • 233頁(yè)

  • MAXIM   MAXIM

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PRODUCT BRIEF
DS3170
DS3/E3 Single-Chip Transceiver
www.maxim-ic.com
GENERAL DESCRIPTION
The DS3170 combines a DS3/E3 framer and an LIU
(single-chip transceiver) to interface to a DS3/E3
physical copper line.
FEATURES
摟
摟
摟
Single-Chip Transceiver for DS3 and E3
Performs Receive Clock/Data Recovery and
Transmit Waveshaping for DS3 and E3
Jitter Attenuator can be Placed Either in the
Receive or Transmit Path
Interfaces to 75W Coaxial Cable at Lengths Up to
380 Meters or 1246 Feet (DS3), or 440 Meters or
1443 Feet (E3)
Uses 1:2 Transformers on Both Tx and Rx
On-Chip DS3 (M23 or C-Bit) and E3 (G.751 or
G.832) Framer
Built-In HDLC Controller with 256-Byte FIFO for
the Insertion/Extraction of DS3 PMDL, G.751 Sn
Bit, and G.832 NR/GC Bytes
On-Chip BERT for PRBS and Repetitive Pattern
Generation, Detection and Analysis
Large Performance-Monitoring Counters for
Accumulation Intervals of At Least 1 Second
Flexible Overhead Insertion/Extraction Port for
DS3, E3 Framers
Loopbacks Include Line, Diagnostic, Framer,
Payload, and Analog with Capabilities to Insert
AIS in the Directions Away from Loopback
Directions
Integrated Clock Rate Adapter to Generate the
Remaining Internally Required 44.736MHz (DS3)
and 34.368MHz (E3) from a Single-Clock
Reference Source
CLAD Reference Clock can be 44.736MHz,
34.368MHz, 77.76MHz, 51.84MHz, or 19.44MHz
Software Compatible with DS3171鈥揇S3174 SCT
Product Family
8-/16-Bit Parallel and Slave SPI Serial (鈮?0Mbps)
Microprocessor Interface
Low-Power (0.5W) 3.3V Operation (5V Tolerant
I/O)
100-Pin Small 11mm (1mm) CSBGA and 14mm
(1.4mm) LQFP Package Options
Industrial Temperature Operation: -40擄C to +85擄C
IEEE1149.1 JTAG Test Port
APPLICATIONS
Access Concentrators
Routers and Switches
SONET/SDH ADM
SONET/SDH Muxes
PBXs
PDH Multiplexer/
Demultiplexer
Multiservice Access
Platforms (MSAPs)
Multiservice Protocol
Platform (MSPPs)
Test Equipment
Digital Cross Connect
Integrated-Access Device
(IAD)
摟
摟
摟
摟
摟
摟
摟
摟
ORDERING INFORMATION
PART
DS3170
DS3170L
DS3170N
DS3170LN
TEMP RANGE
0擄C to +70擄C
0擄C to +70擄C
-40擄C to +85擄C
-40擄C to +85擄C
PIN-PACKAGE
100 CSBGA (11mm x
11mm, 1mm pitch)
100 LQFP (14mm x
14mm, 1.4mm pitch)
100 CSBGA (11mm x
11mm, 1mm pitch)
100 LQFP (14mm x
14mm, 1.4mm pitch)
摟
FUNCTIONAL DIAGRAM
摟
摟
DS3/
E3
LIU
DS3/E3
FRAMER/
FORMATTER
摟
SYSTEM
BACKPLANE
DS3/E3 LINE
摟
摟
摟
摟
DS3170
Note:
Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
may be simultaneously available through various sales channels. For information about device errata, click here:
www.maxim-ic.com/errata.
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