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DS21FF42 Datasheet

  • DS21FF42

  • 4 X 3 Twelve Channel T1 Framer

  • 145頁

  • DALLAS   DALLAS

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DALLAS
SEMICONDUCTOR
DS21FT42 / DS21FF42
4 X 3 Twelve Channel T1 Framer
4 X 4 Sixteen Channel T1 Framer
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IEEE 1149.1 JTAG-Boundary Scan
Architecture
DS21FF42 and DS21FT42 are Pin
Compatible with DS21FF44 and
DS21FT44, respectively, to allow the
Same Footprint to Support T1 and E1
Applications
300鈥損in MCM BGA package (27mm X
27mm)
Low Power 3.3V CMOS with 5V Tolerant
Input & Outputs
FEATURES
P
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Sixteen (16) or Twelve (12) Completely
Independent T1 Framers in One Small
27mm x 27mm Package
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Each Multi-Chip Module (MCM) Contains
Four (FF) or Three (FT) DS21Q42 Die.
Each Quad Framer Can be Concatenated
into a Single 8.192MHz Backplane Data
Stream
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1. MULTI-CHIP MODULE (MCM) DESCRIPTION
The Four x Four and Four x Three MCMs offer a high density packaging arrangement for
the DS21Q42 T1 Enhanced Quad Framer. Either three (DS21FT42) or four (DS21FF42)
silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical
connections as shown in Figure 1-1.
All of the functions available on the DS21Q42 are also available in the MCM packaged
version. However, in order to minimize package size, some signals have been deleted or
combined. These differences are detailed in Table 1-1. In the Four x Three (FT) version,
the fourth quad framer is not populated and hence all of the signals to and from this fourth
framer are absent and should be treated as No Connects (NC). Table 2-1 lists all of the
signals on the MCM and it also lists the absent signals for the Four x Three.
The availability of both a twelve and a sixteen channel version allow the maximum framer
density with the lowest cost. For example, in a T3 application, two devices (one
DS21FF42 and one DS21FT42) provide a total of 28 framers without the additional cost
and power consumption of any unused framers that appear in an octal approach.
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DS21FF42 產(chǎn)品屬性

  • Lead (SnPb) Finish for COTSObsolescence Mitigation Program

  • 40

  • 集成電路 (IC)

  • 接口 - 控制器

  • -

  • T1 調(diào)幀器

  • 并行/串行

  • 2.97 V ~ 3.63 V

  • 300mA

  • 0°C ~ 70°C

  • 表面貼裝

  • 300-BBGA

  • 300-PBGA（27x27）

  • 管件

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