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DKF110PFW1LPG Datasheet

  • DKF110PFW1LPG

  • Solid-State Fingerprint Sensor

  • 238.99KB

  • 24頁

  • FUJITSU   FUJITSU

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MBF110
Solid-State Fingerprint Sensor
Overview
The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct
contact, 鏗乶gerprint acquisition device. It is a high performance,
low power, low cost, capacitive sensor with an integrated two-
dimensional array of metal electrodes in the sensing array. Each
metal electrode acts as one plate of a capacitor and the contacting
鏗乶ger acts as the second plate. A passivation layer on the device
surface forms the dielectric between these two plates. Ridges and
valleys on the 鏗乶ger yield varying capacitor values across the array,
which is read to form an image of the 鏗乶gerprint.
Packages
A block diagram of the MBF110 is shown in Figure 1. The
MBF110 has an integrated 8-bit 鏗俛sh analog-to-digital converter
The MBF110 is manufactured in standard CMOS technology and
to digitize the output of the sensor array. The 鏗乶gerprint image is
is available in an 80-pin, VSPA 80/1 and LQFP 80/1. The 300
脳
transmitted on an 8-bit bi-directional bus interface compatible
300 sensor array has a 50
碌
m pitch and yields a 500-dpi image. The
with most microprocessors.
sensor surface is protected by a patented, ultra-hard, abrasion and
For SETCUR resistor differences between the MBF110 see the Pin
chemical resistant coating.
Information table.
Features
鈥?Non-optical solid-state device
鈥?300
脳
300 sensor array, 50
碌
m pitch
鈥?1.5 cm
脳
1.5 cm sensor area
鈥?500-dpi resolution
鈥?Operation from 3V to 5.5V
鈥?Ultra-hard protective coating
y
r
a
n
i
m
i
l
e
r
P
Applications
鈥?ATM
鈥?Smart cards
80-pin SOP (VSPA)
80-pin TSOP (LQFP)
鈥?Database and network access
鈥?Portable 鏗乶gerprint acquisition
鈥?Access control (home, auto, of鏗乧e, etc.)
鈥?Cellular phone security access
鈥?Integrated 8-bit 鏗俛sh analog-to-digital converter
鈥?8-bit microprocessor interface
鈥?Standard CMOS technology
鈥?Low power, less than 200 mW

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