鈥?/div>
.004
0.10
wt.
grams
.10
.10
Reflow Solder Assembly
Silver-bearing solder (Sn/Pb/Ag 62/36/2%) is recommended;
however, tin-lead eutectic (Sn/Pb 63/37%) may be used.
For temperature profiles, see Application Note AN-40-004
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DBTC-6-4-75L
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040225
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ED-8956/1
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