Surface Mount Zener Diode
COMCHIP
www.comchiptech.com
CZRM27C3V6P
THRU C200P
Features
Low profile surface-mount package
Zener and surge current specification
Low leakage current
Excellent stability
Power Dissipation 0.8Watts
MINI-SMA
0.161(4.1)
0.146(3.7)
0.012(0.3)Typ.
0.071(1.8)
0.055(1.4)
Mechanical Data
Case: Molded plastic MINI-SMA
Epoxy: UL 94V-0 rate flame retardant
Solderable per MIL-STD-202,
method 208 guaranteed
Polarity: cathode band
Mounting position: Any
Weight: 0.04gram(approx.)
0.035(0.9)Typ.
0.110(2.8)
0.094(2.4)
0.063(1.6)
0.055(1.4)
0.035(0.9)Typ.
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25
o
C
ambient temperature unless otherwise specified.
Parameter
VALUE
Units
Forward voltage
IF=0.2A
1.2
V
Power Dissipation
TA=25
C
( Note )
o
TL=80 C
o
0.8
2.3
W
Non-repetitive peak pulse
TJ=25
C
power dissipation
100us square pulse
Non-repetitive peak pulse
TJ=25
C
power dissipation
10/1000us waveform
(CZRM27C7V5P to C100P)
Non-repetitive peak pulse
TJ=25
C
power dissipation
10/1000us waveform
(CZRM27C110P to C200P)
o
o
o
300
W
150
W
100
W
Thermal resistance junction to lead
ambient ( Note )
Operating junction and Storage Temperature
Range
NOTES : Mounted on epoxy-glass PCB with 3 x 3 mm Cu pads (
40um thick)
30
180
KW
150 / -55 to +150
o
C
MDS0310010B
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