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V
CC
11
4
GND
TIP
Handling and Assembly Recommendations
The CYG23XX products are not hermetically sealed and should not be exposed to any liquid-based rinsing processes. Clare recommends two (2) approaches. The
modem should either use a no clean soldering flux that would mostly evaporate during the normal wave soldering processes, or be soldered in by hand after the rest
of the card is wave soldered.
DS-CPC2300-R1
www.clare.com
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