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Yields excellent electrical and
thermal conductivities
Reduces tailing and stringing
in production equipment
Product Description:
AMICON C 850-6 is a fast curing, one
component, low viscosity, silver filled epoxy die attach
adhesive. It features high electrical and thermal
conductivity and high strength at wire bond
temperatures. AMICON C 850-6 also features a low
viscosity to avoid tailing, stringing and dry out problems
in high speed die attach equipment.
Applications:
AMICON C 850-6 is designed for bonding
most plastic packaged ICs and other die attach
applications.
Properties of Material As Supplied:
Property
Chemical Type
Appearance
Density
Brookfield Viscosity
Test Method
Visual
ASTM-D-792
ASTM-D-2393
5 rpm # TC
Unit
3
g/cm
Pa.s
cP
Value
Silver filled epoxy
Silver paste
3.2
75 - 125
75,000 - 125,000
Cure Schedule:
Cure at any one of the recommended cure
schedules. For optimum performance, follow the initial
cure with a post cure of 1-2 hours at the highest
expected use temperature. Alternate cure schedules
may also be possible. Contact your Emerson & Cuming
Technical Representative for further information.
Temperature
擄C
125
150
250
Cure Time
Time (minutes)
60
30
1
鈥淥ur service engineers are available to help purchasers obtain best results from our products, and recommendations are based on tests and information believed to be reliable.
However, we have no control over the conditions under which our products are transported to, stored, handled, or used by purchasers and, in any event, all recommendations
and sales are made on condition that we will not be held liable for any damages resulting from their use. No representative of ours has any authority to waive or change this
provision. We also expect purchasers to use our products in accordance with the guiding principles of the Chemical Manufacturers Association鈥檚 Responsible Care廬 program.鈥?/div>
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