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Full-Color Displays & Moving Message Signs
Solid-State Incandescent Replacement Bulbs
High Ambient Panel Indicators
Color Printers & Scanners
Medical & Analytical Instruments
C430CB290-S000 Chip Diagram
Top View
G鈥iC LED Chip
275 x 275 渭m
Mesa (junction)
246 x 246 渭m
Gold Bond Pad
115 渭m Diameter
Bottom View
Die Cross Section
Anode (+)
PR3L, Rev. M
Datasheet: C
SiC Substrate
t = 250 渭m
Backside
Metallization
Cathode (-)
Subject to change without notice.
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