TENTATIVE DATA SHEET
INFRARED IC INTERNAL
INSPECTION SYSTEM
C2955
From the backside of the chip, you can see through the silicon
substrate to the patterns of the chip by means of an infrared light.
A newly developed infrared CCD camera is used to inspect pattern
images more clearly and easily than ever before.
The C2955 is an IC internal inspection system incor-
porating an infrared microscope and an infrared CCD
camera. Use of a newly developed infrared CCD
camera enables a high sensitivity approximately ten
times that of conventional systems (in comparisons by
HAMAMATSU), at a wavelength of 1.0 碌m, making it
possible to obtain sharp, clear images with high
resolution. Using an infrared light which is transmitted
through the silicon substrate enables observation of
the interconnect lines in the IC, the wire bonding
status, and the die bonding conditions, along with the
diffusion zone conditions, without damaging the part
under observation. Observation can be done from the
back side, when the sample is prepared by scraping
away the molding on the side opposite the surface of
the silicon substrate. Because the metal wiring is
never touched in the inspection process, precise
testing can be carried out under optimum conditions,
making it possible to inspect the condition of the
diffusion zones, the multilayer interconnect lines, the
Al-Si nodules wire bonding interfaces, and die bonding
details.
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Best suited for flip-chip
evaluation
No damage to part under
observation
High sensitivity, high
resolution
Built-in contrast
enhancement function
Shading correction function
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