Formosa MS
Features
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Planar Die Construction
Ultra-Small Surface Mount Package
Ideally suited for Automated Assembly
Processes
Also Available in Lead Free Version
BZT52C2V0S - BZT52C39S
SURFACE MOUNT ZENER DIODE
SPICE MODELS: BZT52C2V0S BZT52C2V4S BZT52C2V7S BZT52C3V0S BZT52C3V3S BZT52C3V6S BZT52C3V9S BZT52C4V3S BZT52C4V7S BZT52C5V1S
BZT52C5V6S BZT52C6V2S BZT52C6V8S BZT52C7V5S BZT52C8V2S BZT52C9V1S BZT52C10S BZT52C11S BZT52C12S BZT52C13S BZT52C15S BZT52C16S
BZT52C18S BZT52C20S BZT52C22S BZT52C24S BZT52C27S BZT52C30S BZT523C33S BZT52C36S BZT52C39S
SOD-323
Dim
A
H
G
A
B
D
Min
2.30
1.60
1.20
0.25
0.20
0.10
0擄
Max
2.70
1.80
1.40
0.35
0.40
0.15
8擄
Mechanical Data
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Case: SOD-323, Plastic
Case material - UL Flammability Rating
Classification 94V-0
Moisture sensitivity: Level 1 per J-STD-020A
Terminals: Solderable per MIL-STD-202,
Method 208
Also Available in Lead Free Plating (Matte Tin
Finish). Please see Ordering Information,
Note 6, on Page 2
Polarity: Cathode Band
Marking: See Sheet 2
Weight: 0.004 grams (approx.)
J
B
C
D
E
G
H
J
a
1.05 Typical
C
E
0.05 Typical
All Dimensions in mm
Maximum Ratings
Forward Voltage (Note 2)
Power Dissipation (Note 1)
@ T
A
= 25擄C unless otherwise specified
Symbol
@ I
F
= 10mA
V
F
P
d
R
qJA
T
j,
T
STG
Value
0.9
200
625
-65 to +150
Unit
V
mW
擄C/W
擄C
Characteristic
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Notes:
1. Part mounted on FR-4 PC board with recommended pad layout, as per http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration test pulse used in minimize self-heating effect.
1
2
3
