BZT52C2V0S - BZT52C39S
SURFACE MOUNT ZENER DIODE
Features
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Planar Die Construction
Ultra-Small Surface Mount Package
Ideally suited for Automated Assembly
Processes
H
G
A
B
D
SOD-323
Dim
A
J
Min
2.30
1.60
1.20
0.25
0.20
0.10
0擄
Max
2.70
1.80
1.40
0.35
0.40
0.15
8擄
Mechanical Data
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Case: SOD-323, Plastic
Case material - UL Flammability Rating
Classification 94V-0
Moisture sensitivity: Level 1 per J-STD-020A
Terminals: Solderable per MIL-STD-202,
Method 208
Polarity: Cathode Band
Marking: See Sheet 2
Weight: 0.004 grams (approx.)
B
C
D
E
G
H
J
a
1.05 Typical
C
E
0.05 Typical
All Dimensions in mm
Maximum Ratings
Forward Voltage (Note 2)
Power Dissipation (Note 1)
@ T
A
= 25擄C unless otherwise specified
Symbol
@ I
F
= 10mA
V
F
P
d
R
qJA
T
j,
T
STG
Value
0.9
200
625
-65 to +150
Unit
V
mW
擄C/W
擄C
Characteristic
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Notes:
1. Part mounted on FR-4 PC board with recommended pad layout, as per http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration test pulse used in minimize self-heating effect.
DS30093 Rev. 9 - 2
1 of 3
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BZT52C2V0S - BZT52C39S