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High temperature soldering guaranteed:
250擄C, 0.25" (6.35mm) from case for 10 seconds
0.600 (15.5)
0.580 (14.5)
0.670 (17.2)
0.646 (16.4)
2
0.350 (8.89)
0.330 (8.38)
PIN
1
0.191 (4.85)
0.171 (4.35)
0.560 (14.22)
0.530 (13.46)
0.060 (1.52)
0.110 (2.80)
0.100 (2.54)
MECHANICAL DATA
Case:
JEDEC ITO-220AC molded plastic body over
passivated chip
Terminals:
Plated lead solderable per MIL-STD-750,
Method 2026
Polarity:
As marked
Mounting Position:
Any
Weight:
0.064 ounce, 1.81 grams
Mounting Torque:
5 in. - lbs. max.
0.037 (0.94)
0.027 (0.69)
0.205 (5.20)
0.195 (4.95)
PIN 1
PIN 2
0.022 (0.55)
0.014 (0.36)
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
BYWF29-50
BYWF29-100 BYWF29-150 BYWF29-200
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at T
C
=125擄C
Peak forward surge current 10ms
single half sine-wave superimposed T
J
=150擄C
Maximum instantaneous forward voltage at:
I
F
=20A, T
J
=25擄C
I
F
=8A, T
J
=150擄C
Maximum DC reverse current
at rated DC blocking voltage
Maximum reverse recovery time
(NOTE 1)
Typical junction capacitance
(NOTE 2)
(NOTE 3)
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
50
35
50
100
70
100
8.0
100.0
150
105
150
200
140
200
Volts
Volts
Volts
Amps
Amps
V
F
1.3
0.8
10.0
500.0
25.0
45.0
4.5
-65 to +150
Volts
碌A(chǔ)
ns
pF
擄C/W
擄C
T
C
=25擄C
T
C
=100擄C
I
R
t
rr
C
J
R
螛JC
T
J
, T
STG
Maximum thermal resistance
Operating and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=1A, V
R
=30V, di/dt=100A/碌s, I
rr
=10%, I
RM
for measurement of t
rr
(2) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to case mounted on heatsink
4/98
1
2
