鈾?/div>
High temperature soldering in accordance with
CECC 802 / Reflow guaranteed
0.380 (9.65)
0.420 (10.67)
0.245 (6.22)
MIN
K
0.160 (4.06)
0.190 (4.83)
0.045 (1.14)
0.055 (1.40)
0.320 (8.13)
0.360 (9.14)
1
K
2
0.575 (14.60)
0.625 (15.88)
0.047 (1.19)
0.055 (1.40)
SEATING
PLATE
-T-
0.090 (2.29)
0.110 (2.79)
0.018 (0.46)
0.025 (0.64)
0.027 (0.686)
0.037 (0.940)
0.080 (2.03)
0.110 (2.79)
MECHANICAL DATA
Case:
JEDEC TO-263AB molded plastic body
Terminals:
Plated lead solderable per MIL-STD-750,
Method 2026
Polarity:
As marked
Mounting Position:
Any
Weight:
0.08 ounce, 2.24 grams
0.095 (2.41)
0.100 (2.54)
PIN 1
K - HEATSINK
PIN 2
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
BYWB29-50 BYWB29-100 BYWB29-150 BYWB29-200
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at T
C
=125擄C
Peak forward surge current 10ms
single half sine-wave superimposed T
J
=150擄C
Maximum instantaneous forward voltage at:
I
F
=20A, T
J
=25擄C
I
F
=8A, T
J
=150擄C
Maximum DC reverse current
at rated DC blocking voltage
Maximum reverse recovery time
(NOTE 1)
Typical junction capacitance
(NOTE 2)
(NOTE 3)
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
50
35
50
100
70
100
8.0
100.0
150
105
150
200
140
200
Volts
Volts
Volts
Amps
Amps
V
F
1.3
0.8
10.0
500.0
25.0
45.0
3.0
-65 to +150
Volts
碌A(chǔ)
ns
pF
擄C/W
擄C
T
C
=25擄C
T
C
=100擄C
I
R
t
rr
C
J
R
螛JC
T
J
, T
STG
Maximum thermal resistance
Operating and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=1A, V
R
=30V, di/dt=100A/碌s, I
rr
=10%, I
RM
for measurement of t
rr
(2) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to case mounted on heatsink
4/98
1
2
