鈥?/div>
Leads are Readily Solderable
Lead Temperature for Soldering Purposes:
260擄C Max. for 10 Seconds
Shipped 50 units per plastic tube
Marking: BYW29-200
Device Meets MSL1 Requirements
ESD Ratings: Machine Model, C (> 400 V)
Human Body Model, 3B (> 8000 V)
1
Symbol
V
RRM
V
RWM
V
R
I
F(AV)
Value
200
Unit
V
3
CASE 221B
TO - 220AC
PLASTIC
4
MARKING DIAGRAM
BYW29- 200
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
Total Device, (Rated V
R
),
T
C
= 150擄C
Peak Repetitive Forward Current
(Rated V
R
, Square Wave, 20 kHz),
T
C
= 150擄C
Nonrepetitive Peak Surge Current
(Surge Applied at Rated Load Condi-
tions Half - wave, Single Phase, 60 Hz)
Operating Junction Temperature and
Storage Temperature Range
BYW29- 200 = Device Code
8.0
A
ORDERING INFORMATION
I
FM
16
A
Device
100
A
BYW29- 200
Package
TO - 220
Shipping
50 Units/Rail
I
FSM
T
J
, T
stg
- 65 to +175
擄C
THERMAL CHARACTERISTICS
Maximum Thermal Resistance, Junction
to Case
R
qJC
3.0
擄C/W
漏
Semiconductor Components Industries, LLC, 2003
1
June, 2003 - Rev. 0
Publication Order Number:
BYW29/D